PHOENFIX HW-8.5 40g Chip Thermal Conductive Grease Paste Heat Sink Compound For CPU GPU LED COB Heat-dissipating Silicone Plaster

The PHOENFIX HW-8.5 is a thermal conductive grease paste designed to enhance thermal conductivity between components, such as CPUs, GPUs, and other heat-generating devices and their respective heat sinks.

Here are the key features, specifications, and applications of this thermal paste:

Key Features and Specifications

• Model: PHOENFIX HW-8.5
• Weight: 40g
• Type: Thermal Conductive Grease Paste
• Base Material: Silicone-based formula for excellent thermal conductivity and stability.
• Thermal Conductivity: High thermal conductivity rating, typically in the range of 8.5 W/mK, which helps efficiently transfer heat away from components.
• Viscosity: Optimized viscosity for easy application and spreadability over surfaces.
• Non-Conductive: The paste is designed to be non-conductive electrically, making it safe to use on electrical components without risk of short circuits.
• Temperature Range: Generally effective over a wide temperature range, often from -50°C to +200°C (-58°F to +392°F), making it suitable for various applications.
• Durability: Resistant to degradation over time, ensuring prolonged performance and thermal efficiency.
• Easy Application: Comes in a squeeze tube or container, allowing for easy application and precise dispensing.

Applications

• CPU and GPU Cooling: Ideal for use in PCs and gaming systems to enhance the performance of

Package Includes:

1 x PHOENFIX HW-8.5 40g Chip Thermal Conductive Grease Paste Heat Sink Compound For CPU GPU LED COB Heat-dissipating Silicone Plaster