PHOENFIX HW-6.0 40g Chip Thermal Conductive Grease Paste Heat Sink Compound For CPU GPU LED COB Heat-dissipating Silicone Plaster

The PHOENFIX HW-6.0 is a thermal conductive grease paste designed to enhance heat dissipation in various electronic applications.

Here’s a detailed overview of its features, specifications, and potential uses:

Key Features and Specifications

• Model: PHOENFIX HW-6.0
• Weight: 40g
• Type: Thermal Conductive Grease Paste (often referred to as thermal paste or thermal compound)
• Base Material: Silicone-based formula that provides good thermal conductivity and stability.
• Thermal Conductivity: Typically rated around 6.0 W/mK, offering a good balance of performance for various cooling applications.
• Viscosity: Formulated for easy application, allowing for smooth spreading over surfaces, which helps achieve an even layer for optimal thermal transfer.
• Non-Conductive: Non-electrically conductive, making it safe for use on sensitive electronic components and minimizing the risk of short circuits.
• Temperature Range: Generally effective in a wide temperature range, typically from -50°C to +200°C (-58°F to +392°F), suitable for diverse operating environments.
• Durability: Offers long-lasting performance with a resistance to drying out, maintaining effectiveness over extended periods.
• Application Method: Usually comes in a tube or container designed for easy dispensing and application.

Applications

• CPU and GPU Cooling: Ideal for enhancing thermal management in a variety of computer systems, including desktop and laptop processors as well as graphics cards.
• LED Cooling: Suitable for use in LED lighting applications, where effective heat dissipation helps maintain efficiency and prolongs lifespan.
• COB (Chip-On-Board) Applications: Works well in COB LED setups where maintaining optimal operating temperatures is critical.
• General Electronics: Can be used in a wide range of electronic devices that require efficient thermal management to prevent overheating.

Summary

The PHOENFIX HW-6.0 thermal paste serves as an excellent option for users seeking a balance of thermal conductivity and ease of application. With a thermal conductivity rating of 6.0 W/mK, it is positioned as a versatile thermal interface material suitable for a range of applications, including CPU and GPU cooling, LED technology, and general electronics. Its non-conductive nature and durability make it a safe and reliable choice for both hobbyists and professionals looking to enhance thermal performance in their devices.

Package Includes:

1 x PHOENFIX HW-6.0 40g Chip Thermal Conductive Grease Paste Heat Sink Compound For CPU GPU LED COB Heat-dissipating Silicone Plaster