PHOENFIX HW-4.0 30g Chip Thermal Conductive Grease Paste Heat Sink Compound For CPU GPU LED COB Heat-dissipating Silicone Plaster

The PHOENFIX HW-4.0 is another thermal conductive grease paste that serves a similar purpose to the HW-8.5 model, but with some variations in its specifications.

Here’s an overview of its features, specifications, and potential applications:

Key Features and Specifications

• Model: PHOENFIX HW-4.0
• Weight: 30g
• Type: Thermal Conductive Grease Paste
• Base Material: Silicone-based formula, known for its thermal conductivity and stability.
• Thermal Conductivity: Lower than HW-8.5, typically rated around 4.0 W/mK, still providing decent thermal transfer capabilities.
• Viscosity: Designed for easy application and smooth spreading over surfaces.
• Non-Conductive: Non-electrically conductive, safe for use on electronic components and prevents short circuits.
• Temperature Range: Effective within a wide temperature range, often from -50°C to +200°C (-58°F to +392°F), suitable for different environments and conditions.
• Durability: Long-lasting with resistance to drying out, ensuring continued effectiveness over time.
• Application Method: Packaged in a convenient tube or container for straightforward application.

Applications

• CPU and GPU Cooling: Suitable for thermal management in desktops, laptops, and gaming consoles by improving heat dissipation from processors and graphic cards.
• LED Cooling: Can be used for heat dissipation in LED lighting applications, ensuring optimal performance and longevity.
• COB (Chip-On-Board) Applications: Effective for use in COB LEDs where efficient thermal management is crucial.
• General Electronics: Useful in various electronic devices where heat generation needs to be effectively managed.

Summary

The PHOENFIX HW-4.0 thermal paste is a reliable option for users looking for an effective way to enhance the thermal interface between heat-generating components and heat sinks, providing an adequate balance of thermal performance, durability, and ease of application. While it has a lower thermal conductivity compared to its HW-8.5 counterpart, it is still a capable choice for many applications requiring thermal management solutions.

Package Includes:

1 x PHOENFIX HW-4.0 30g Chip Thermal Conductive Grease Paste Heat Sink Compound For CPU GPU LED COB Heat-dissipating Silicone Plaster