HC-05 4pin Bluetooth Module(Master/Slave) with Button

Features:

1. CPU and Memory: Xtensa® 32-bit LX6 Dual-core processor, up to 600 DMIPS.
2. 448 KByte ROM
3. 520 KByte SRAM
4. 16 KByte SRAM in RTC.
5. QSPI can connect up to 4* Flash/SRAM, each flash should be less than 16 Mbytes.
6. Supply Voltage: 3V~3.6V

Specification :

• CPU and Memory: Xtensa® 32-bit LX6 Dual-core processor, up to 600 DMIPS.
• 448 KByte ROM
• 520 KByte SRAM
• 16 KByte SRAM in RTC.
• QSPI can connect up to 4* Flash/SRAM, each flash should be less than 16 Mbytes.
• Supply Voltage: 3V~3.6V
  

  WIFI :

  • 802.11 b/g/n/e/i.
  • 802.11 n (2.4 GHz), up to 150 Mbps.
  • WMM-PS, UAPSD.
  • 802.11 e: QoS for wireless multimedia technology.
  • MPDU and A-MSDU aggregation.
  • Block ACK.
  • Fragmentation and defragmentation.
  • Automatic Beacon monitoring/scanning.
  • 802.11 I security features: pre-authentication and TSN.
  • Wi-Fi Protected Access (WPA)/WPA2/WPA2-Enterprise/Wi-Fi Protected Setup (WPS).
  • Infrastructure BSS Station mode/SoftAP mode.
  • Wi-Fi Direct (P2P), P2P Discovery, P2P Group Owner mode and P2P Power Management.
  • UMA compliant and certified.
  • Antenna diversity and selection.
    

    Bluetooth :

    • Compliant with Bluetooth v4.2 BR/EDR and BLE specification
    • Class-1, class-2 and class-3 transmitter without the external power amplifier
    • Enhanced power control
    • +10 dBm transmitting power
    • NZIF receiver with -98 dBm sensitivity
    • Adaptive Frequency Hopping (AFH)
    • Standard HCI based on SDIO/SPI/UART High-speed UART HCI, up to 4 Mbps
    • BT 4.2 controller and host stack
    • Service Discovery Protocol (SDP)
    • General Access Profile (GAP)
    • Security Manager Protocol (SMP)
    • Bluetooth Low Energy (BLE)
    • ATT/GATT
    • HID
    • All GATT-based profile supported
    • SPP-Like GATT-based profile
    • BLE Beacon
    • A2DP/AVRCP/SPP, HSP/HFP, RFCOMM
    • CVSD and SBC for audio codec
    • Bluetooth Piconet and Scatternet