Solder Welding Paste Flux UV 559 10CC Mechanic Needle Soldering Glue

Specifications :

  1. Model:  UV 559 Clean Welding Flux BGA Solder Ball Repair Soldering Paste For Phone
  2. Viscosity: 150Pa-s
  3. Melting point: 183 ° C

 

SKU: RDNA-590.3

Apple Shopping Event

Hurry and get discounts on all Apple devices up to 20%

Sale_coupon_15

413.00 (Inc. GST)
350.00 (+18% GST Extra)

Only 2 left in stock

Only 2 left in stock

14 People watching this product now!
  • Pick up from the RoboticsDNA Store in Pune / Dunzo

To pick up today

Free

  • Same Day Delivery in Pune

(Mon-Sat) (Please Place Order Before 1:30 PM)​

Rs. 99

  • via Delhivery.com (Express Mode)

Our courier will deliver to the specified address

3-5 Days

Rs. 149

  • via Delhivery.com (Surface Mode)

Our courier will deliver to the specified address

4-7 Days

Rs. 69

Payment Methods:

Description

MECHANIC FLUX PASTE 559 10CC Product Features Professional advanced OEM RMA-223/559 BGA soldering paste flux+squeeze tube +free needle tip. 100% new brand and high quality. Good immersion and high intensity joint. Easy to peel off with hands or tweezers, leave no residue. Won’t oxidating gold, copper, phosphorus, bronze, oxidation. Prevent contamination during assembly. RMA-223/559: high viscosity no-clean flux, reprocessing PCB, BGA, PGA , for soldering computer/phone chips. RMA-223/559 is the mixture of high-quality alloyed powder and resinic pasty flux, it can avoid the pale yellow residue. High soaking ?high strength joints. No-toxic, no-corrosive, strong ability of insulation. Good insulation and smooth welding surface. No deterioration no dry. No poison no orrosion, no damage to parts. Product Specifications Flux Type: RMA-559 Volume: 10ml/10cc Dimension: 93 x 33 x 23mm Material: the mixture of high-quality alloyed powder and resinic pasty flux, it can avoid the pale yellow residue. Color: Yellow Insulated: Yes With Needle Tip: Yes Application: for soldering and reballing of computer and phone chips. Advantage: Good immersion and high intensity joint. Function: for PCB , BGA , PGA reworkin. 100%: New Type, high quality.

Specification

Overview

Weight 0.026 kg
Dimensions 17.5 × 8.3 × 17.5 cm

Processor

Weight 0.026 kg
Dimensions 17.5 × 8.3 × 17.5 cm

Display

Weight 0.026 kg
Dimensions 17.5 × 8.3 × 17.5 cm

RAM

Weight 0.026 kg
Dimensions 17.5 × 8.3 × 17.5 cm

Storage

Weight 0.026 kg
Dimensions 17.5 × 8.3 × 17.5 cm

Video Card

Weight 0.026 kg
Dimensions 17.5 × 8.3 × 17.5 cm

Connectivity

Weight 0.026 kg
Dimensions 17.5 × 8.3 × 17.5 cm

Features

Weight 0.026 kg
Dimensions 17.5 × 8.3 × 17.5 cm

Battery

Weight 0.026 kg
Dimensions 17.5 × 8.3 × 17.5 cm

General

Weight 0.026 kg
Dimensions 17.5 × 8.3 × 17.5 cm

Customer Reviews

0 reviews
0
0
0
0
0

There are no reviews yet.

Only logged in customers who have purchased this product may leave a review.