Mechanic IX5 Ultra Universal Preheating Station

Specifications:

  • Model: MECHANIC iX5 Ultra (Breakthrough iX 5Ultra)
  • Heating Method: Constant Temperature Heating Platform (No air gun or soldering iron required)
  • Heating Panel Material: Aluminum Alloy Panel (Ensures uniform heat distribution)
  • Voltage: 220V (Requires selection based on region)
  • Power Output: Not explicitly listed, but the compact size suggests a relatively low-wattage design focused on efficiency.
  • Temperature Range (Adjustable): 20 to 185 Deg C. (Freely controlled and thermostatic)
  • Product Size (L x W x H): Approximately 80 x 80 x 57.6 mm (Very compact and lightweight)
  • Net Weight: Approximately 181.7g (Extremely lightweight for bench use)
  • Key Applications:
    • Motherboard Delamination/Layering (Separating and rejoining multi-layered PCBs)
    • Tin Planting / Reballing (Preparing BGA components)
    • Glue Removal / Degumming
    • Dot Matrix Repair (Crucial for face ID repair)
  • Compatibility: Universal fit for all sizes of mobile phone motherboards (Including iPhone X-15 Pro Max, Huawei, Samsung, and other Android phones).

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2,583.99 (Inc. GST)
2,189.83 (+18% GST Extra)

Only 2 left in stock

Only 2 left in stock

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    • Pick up from the RoboticsDNA Store in Pune / Dunzo

    To pick up today

    Free

    • Same Day Delivery in Pune

    (Mon-Sat) (Please Place Order Before 1:30 PM)​

    Rs. 99

    • via Delhivery.com (Express Mode)

    Our courier will deliver to the specified address

    3-5 Days

    Rs. 149

    • via Delhivery.com (Surface Mode)

    Our courier will deliver to the specified address

    4-7 Days

    Rs. 69

    Payment Methods:

    Description

    The Mechanic IX5 Ultra Universal Preheating Station is designed specifically for repairing phone motherboards and is particularly effective at removing glue and facilitating various repair tasks, including dot matrix repairs. Here’s an overview of its features, specifications, applications, and usage guidelines:

    Features

    1. Layered Heating Platform:
      • The preheating station features a multi-layer heating design that ensures even and efficient heat distribution across the surface. This helps to soften adhesive and allows for easier disassembly of components.
    2. Adjustable Temperature Control:
      • Users can adjust the temperature settings to suit different types of adhesives and materials, ensuring optimal heat application without damaging delicate components.
    3. Universal Compatibility:
      • Designed to accommodate a wide range of smartphone models and components, making it a versatile tool for both professionals and hobbyists in the smartphone repair industry.
    4. User-Friendly Interface:
      • Typically includes a digital display and intuitive controls, allowing users to monitor and set parameters with ease.
    5. Fast Heating Function:
      • Quick heat-up capabilities reduce waiting time, allowing for efficient workflow during repair tasks.
    6. Built-In Safety Features:
      • Many models come with over-temperature protection and an automatic shut-off feature to enhance safety during operation.

    Specifications

    • Power Supply: Typically operates on standard AC power (e.g., 220V depending on region).
    • Temperature Range: Generally adjustable from approximately 20 to 185 Deg C.
    • Heating Area Size: Varies by model but often measures around 30 cm x 30 cm or larger to accommodate various devices.
    • Heating Method: Infrared or forced air heating options depending on the design.

    Applications

    1. Glue Removal:
      • Especially useful for removing adhesive residues from smartphone displays and other components, making reassembly easier and cleaner.
    2. Dot Matrix Repair:
      • Facilitates repair processes for dot matrix screens and other complex electronic components that require controlled heating.
    3. Motherboard Repair:
      • Aids in the repair and replacement of phone motherboards by allowing technicians to safely heat and remove components without damage.
    4. General Electronics Repair:
      • Can be used for general repair tasks across various devices that require careful heat application.

    Usage Guidelines

    • Preheating Recommendations: Allow the preheating platform to reach the desired temperature before placing any components on it to ensure effective heat transfer.
    • Temperature Adjustments: Adjust the temperature based on the specific adhesive used in the device. Some adhesives may require lower temperatures for safe removal.
    • Safety Precautions: Always use heat-resistant gloves and work in a well-ventilated area to avoid exposure to fumes or potential burns.
    • Component Handling: Use appropriate tools (like tweezers and plastic opening tools) to handle heated components to prevent damage and ensure safety.

    The Mechanic IX5 Ultra Preheating Station is a valuable tool for mobile device repair technicians, streamlining the process of disassembling and repairing various components efficiently and safely.

    Package Includes:

    1 x Mechanic IX5 Ultra Universal Preheating Station Layered Heating Platform for Phone Motherboard Glue Removal Dot Matrix Repair

    Specification

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